Copper alloy via bottom liner

ABSTRACT

Improved mechanical and adhesive strength and resistance to breakage of copper integrated circuit interconnections is obtained by forming a copper alloy in a copper via/wiring connection in an integrated circuit while minimizing adverse electrical effects of the alloy by confining the alloy to an interfacial region of said via/wiring connection and not elsewhere by a barrier which reduces or substantially eliminates the thickness of alloy in the conduction path. The alloy location and composition are further stabilized by reaction of all available alloying material with copper, copper alloys or other metals and their alloys.

BACKGROUND OF INVENTION

The present invention generally relates to semiconductor integratedcircuit structures and, more particularly, to electrical interconnectionstructures formed of copper in integrated circuit devices.

Well-recognized improvements in performance, functionality and economyof manufacture have led to integrated circuit designs at extreme levelsof device density and reduced size of electronic structures, such astransistors and capacitors, and conductive interconnections betweenthem. At the same time, higher clock rates have increased requirementsfor low resistance of interconnection structures and reduced capacitivecoupling between them in order to reduce signal propagation time whilesubjecting such structures to increased thermal cycling, often ofincreased severity. Moreover, increased integration density places morestringent requirements for reliability of interconnections on structuresof increased complexity with increased numbers of regions which may berelatively more subject to failure, possibly causing failure of anentire device.

In the past few years, copper has been substituted for aluminum inselected structures or layers or even throughout high performanceintegrated circuits to achieve reduced connection resistance, goodmechanical strength and more rapid signal propagation even though copperhas relatively poor adhesive strength to other materials and vice-versaunless complex and special processing is employed and which may resultin compromise of electrical properties. In some cases, recentlydeveloped insulating materials having a low dielectric constant (e.g.below 4.0), referred to as low-k materials, have also been used.

However, the low bulk resistance of copper, as well as its mechanicalstrength, can be compromised by contamination or additional materialsprovided, for example, to increase adhesion between layers and/or reduceelectromigration of conductor material. Low-k materials can also besubject to contamination, particularly in regard to materials that maycause corrosion of copper and may also cause mismatches of thermalexpansion coefficients that can impose increased mechanical stresses oncopper conductors and thus may drive breakage of weak vias. As thevia-line contact from one interconnect level to another involves severalintermediate processing steps between the respective metallizations,including breaking the vacuum, depositing a cap and interlayerdielectric, etching, stripping, cleaning and the like, there issignificant opportunity for contamination and/or oxidation of thisinterface.

As such, the predominant yield and defect reliability defect failuremechanism in all types of multi-level on-chip metallization schemestends to be at this via-line interface. That is, the layered nature ofintegrated circuit devices tends to increase the possibility ofcontamination of surfaces and/or alloying of materials withunpredictable results which may be contrary to the result intended orwhich may, for example, improve electro-migration or adhesion propertieswhile degrading bulk resistance or vice-versa. Properties of alloys canalso change radically with relative concentration of alloying materialsand unreacted materials may diffuse and cause such changes inconcentration during thermal cycling.

For example, alloying tin, indium and/or magnesium and the like withcopper to reduce electro-migration without adversely affecting bulkresistance has been attempted. However, it has been found that suchalloying materials getter contaminants such as sulfur and oxygen whichincrease bulk resistance by alloy scattering and may impede copper graingrowth after electroplating, for further resistance increase. In othercases, differing solubility of alloying materials in copper or copper inother materials has required complex processing to regulate alterationof alloy composition or other undesirable effects such as copperprecipitation.

In summary, while copper interconnections and via structures canpotentially provide greatly improved performance by reducing signalpropagation time, that performance enhancement may be compromised andthe likelihood of a number of failure modes is increased due to thestrong tendency toward compromised adhesion to copper as well asdifficulty of avoiding or regulating reaction of copper with othermaterials which may cause increase of bulk resistance or adhesiveweakness or both. Such weakness, tending to cause breakage, or increasedbulk resistance is generally encountered at the interface ofinterconnection and via structures where different materials may belayered and/or contamination is most likely and where it is mostdifficult to avoid reaction of copper without substantial increase ofprocessing complexity. This problem is common, albeit to differingdegrees, to all multi-level metallization schemes such as aluminum,silver, gold and tungsten.

SUMMARY OF INVENTION

It is therefore an object of the present invention to provide astructure which provides increased strength and reliability ofinterconnect and via structures, particularly at their connections withno significant impact on bulk resistance or processing complexity.

In order to accomplish these and other objects of the invention, abarrier is provided adjacent a layer of alloying material to confine thealloying material within a small, shallow region of the metal or metalalloy on only one side of an interface between layers and not elsewhere.The alloy may be formed as the alloying material is deposited (e.g. at ahigh temperature) or later by heat treatment such as annealling toconsume all available alloying material to stabilize the location andcomposition of the alloyed region. The barrier as well as the alloyedregion also serves to avoid the metal or metal alloy on either side ofthe interface from sourcing further alloying beyond the shallow regionat the interface between metal of metal alloy of respective layers.

Thus, in accordance with one aspect of the invention, an integratedcircuit is provided including a first layer having metal or metal alloyat a surface thereof, a second layer adjacent said surface having ametal or metal alloy via therein, an interlayer connection between metalor metal alloy of the first layer and the metal or metal or metal alloyof the second layer comprising an alloy region restricted to aninterfacial region of the first layer and the second layer by a barrierlayer.

In accordance with another aspect of the invention, a method of forminga connection between metal or metal alloy at a surface of a first layerand a metal or metal alloy via of a second layer is provided, comprisingsteps of depositing an alloying material, and forming a copper alloyconfined to an interfacial region of the first layer and the secondlayer by a barrier.

BRIEF DESCRIPTION OF DRAWINGS

The foregoing and other objects, aspects and advantages will be betterunderstood from the following detailed description of a preferredembodiment of the invention with reference to the drawings, in which:

FIGS. 1, 2 and 3 are cross-sectional views of a process for forming afirst embodiment of the invention,

FIGS. 4, 5 and 6 are cross-sectional views of a process for forming asecond embodiment of the invention,

FIG. 6A is a sectional view of a portion of FIG. 6, and

FIGS. 7, 8 and 9 are cross-sectional views of a process for forming athird embodiment of the invention.

DETAILED DESCRIPTION

Referring now to the drawings, and more particularly to FIGS. 1-3, thereis shown, in cross-section, the process of forming a first embodiment100 of the invention.

It should be borne in mind during the following discussion of differentembodiments of the invention, that the basic principle of the inventionis to form a copper alloy of desired properties selectively and in alocation which is restricted to the interface of via and interconnect(sometimes referred to hereinafter as wire or wiring structures but suchterminology is not intended to include a discrete wire such as may bebonded to a chip for off-chip connections) structures and not elsewhere.This is achieved, in accordance with the most basic principles of theinvention, by use of two liner layers of alloying and barrier materials,respectively.

The alloying material layer provides an easily regulated amount ofalloying material which is, preferably, entirely reacted with copper toform a graded and thus highly stable alloy composition distribution withstable desired properties. The alloy region also has graded mechanicalproperties which tends to distribute stresses applied thereto, reducingpotential tendencies toward metal fatigue at via/wiring interfaces dueto thermal cycling. Typically, the alloying diffusion is limited to atmost one diffusion length beyond the reaction front where a fullystoichiometric alloy has formed. In many alloying systems such as Cu/Snor Cu/In bronzes, the resulting alloy also acts as a diffusion barrieragainst the further penetration of alloying element or copper throughthe stoichiometrically formed alloy layer.

The barrier layer further confines and regulates the diffusion andreaction of the alloying material during annealing to form the desiredalloy and thus further enhances the stability of the alloy compositiondistribution and location as well as reducing the thickness of the alloyregion to limit adverse effects of resistance of the alloy region. Inthe case where the alloying film is not removed from regions away fromthe via-line (reacted) contact area, the barrier is necessary toseparate the alloying film from subsequent copper fill throughout thevias and interconnection trenches on the upper dual-Damascene level.

Only the via-line contact area is allowed to react to form the alloy,and in the case of the first and second embodiment of the invention, thecopper reactant is sourced from the line below the via-line interfaceor, in the case of the third embodiment, the copper reactant is sourcedfrom the via above the interface. In the case where the unreactedalloying film is selectively removed, the remaining material is fullyreacted and may not act as a significant source for further diffusion orreaction with the copper above. The liner/diffusion barrier is stillnecessary in its role for avoiding copper diffusion outside the barrier.The confinement of the alloy also avoids detrimental effects on wire andvia resistance which would be caused by copper consumption after alloyformation in non-restricted areas.

Broadly, FIGS. 1-3 show the formation of one wiring layer above anotherlayer which may be the surface of a nearly completed chip (e.g. afterformation of active devices) or another wiring layer. The lower layer,as illustrated, is depicted as a wiring layer (which, if it is thelowest wiring level would be referred to as the first metal or M1layer), for simplicity and comprises an insulating material, oftenreferred to as an interlayer dielectric (ILD) layer 110 having trenches120 formed therein which are filled with copper 130. Such a wiringstructure is referred to as a Damascene conductor and is much preferredfor copper wiring/interconnects since it structurally supports thecopper and can be fabricated with good precision because trenches may beformed more accurately than copper can be otherwise patterned. However,the invention is equally applicable to interconnect structures formed byother techniques, and for interconnects of other base metals such asaluminum, gold, silver and tungsten.

The layer to be formed thereon is also a wiring layer and is connectedto the lower (M1) layer by vias and thus, if placed on an M1 layer,would be identified as a V1/M2 layer since it would be the first layerwith vias and the second layer with metal interconnects. The wiring/viastructures of the second (V1/M2) layer are depicted as so-calleddual-Damascene structures since two different patterning processes areemployed in forming the different depths of the trenches and viaapertures. However, other structures could be employed to which theinvention is equally applicable.

As will be understood by those skilled in the art, any layer overlaid onanother is subject to registration or “overlay” errors 140 which areillustrated to indicate that the invention may be practiced withoutengendering any sensitivity or criticality in regard to the presence ormagnitude of such errors. On the contrary, it should be evident from theillustration of overlay errors that the cross-sectional area of theinterface of the vias of the V1/M2 layer and the interconnects of the M1layer may be substantially reduced by such errors and mechanicalweakness and increased resistance engendered thereby. Therefore itshould also be appreciated that the confinement of alloying inaccordance with the invention provides increased mechanical strengthwhere it is most needed without significantly further compromising lowresistance connections.

As illustrated in FIG. 1, a layer 150 is provided (in the case of copperbut generally not in the case of aluminum or tungsten) over the M1layer. This barrier layer is preferably an insulator of silicon nitride,silicon carbide or the like which can function as both a barrier,particularly when a low-k material that is particularly subject todiffusion of moisture is used as the ILD, and an etch stop for thesubsequent via level and is sometimes referred to as a cap layer or(somewhat inaccurately) as a copper cap. The ILD layer 160 is thenformed and patterned as both a barrier to copper out-diffusion and,particularly, to form the wiring trenches 170 and via openings 180 inaccordance with the chip design. The cap layer provides substantialconvenience as an etch stop in this process and then opened using thepatterned ILD layer as a mask using a process well-understood in theart. Then, as shown in FIG. 2, a layer or fil of alloying material 210is applied preferably by sputtering at high temperature to form an alloywith exposed copper as it is deposited. A high temperature process ismuch preferred to assure that all alloying material deposited on exposedcopper 130 is reacted with the copper as it is deposited, as illustratedat 220, so that no unreacted alloying material will remain at the trenchbottom where it might be available to diffuse into and alloy with thecopper at a later time.

The alloying material can be freely chosen to provide the desiredconductivity and mechanical properties and tin, indium, nickel, gold,silver, aluminum, beryllium, tellurium, magnesium, zinc, zirconium andthe like are considered suitable for practice of the invention. Thethickness of the alloying material liner component should be chosen toprovide the desired alloying material concentration. The depositiontemperature should be chosen in consideration of the deposition rate anddiffusion rate of the alloying material in copper to achieve the desiredgradation of alloying material composition. The unreacted alloyingmaterial can then be removed, as illustrated in FIG. 3, (e.g. by wet ordry etching), as is generally preferred since it could provide a source,albeit small, of additional alloying material, if left in place. Also,if left in place, it displaces interconnect volume that could otherwise(and more preferably) be occupied by copper. Finally, as it is incontact with the interlevel dielectric material on the via and trenchsidewalls and trench bottoms, it may not be desirable from thestandpoint of adhesion, diffusion, corrosion, leakage and the likecompared with the more typical diffusion barrier in contact with thedielectric at these interfaces.

Then, as shown in FIG. 3, the barrier layer 310 component of the lineris deposited. The barrier layer is preferably of tantalum, tungsten ortitanium or alloys or nitrides thereof (although a barrier of one ormore layers of other conductive materials is possible) and should be asthin as possible consistent with providing a barrier to diffusion of thealloying material. Most preferred is a bilayer of TaN/Ta. The barrierlayer 310 is then preferably followed by a seed layer and copper 330 toform the dual Damascene conductor and via is applied, preferably byelectroplating. The excess metal films remaining on the top surface areremoved by chemical mechanical planarization (CMP) back to the ILD layer160 to complete the conductor layer in accordance with the invention.

It should be noted that the alloying layer, barrier layer, seed layerand plated copper layer need not be patterned since portions of theselayers on the upper surface of ILD layer 160 are removed by theplanarization of the copper 330. It should also be appreciated that theregion in which the alloy material 220 is located is stabilized at avery small thickness and cannot extend upward due to barrier layer 310and is laterally confined to the interface between copper wiring 130 andthe via portion of copper wiring 330 where the additional adhesivestrength is needed for highly reliable via connections while minimizingany effects of higher resistivity of the alloy material.

Referring now to FIG. 4, a second embodiment of the invention will nowbe discussed. It will be recalled that the first embodiment wasdescribed in connection with a dual Damascene wiring and via structure,it was equally applicable to other wiring and via structures whereadditional adhesive strength is needed. The second embodiment, however,provides substantial enhancements of the meritorious effects of theinvention when applied to dual Damascene structures by even furtherconfining the alloy region to a small annulus at the boundary of thevia/wiring interface. Further, the second embodiment provides additionaladvantages when used with a dual Damascene process in combination with alow-k dielectric in which a barrier layer of tantalum or the like isneeded to protect the low-k ILD from moisture.

In the following discussion of the second embodiment of the invention,elements which have been discussed above in connection with the firstembodiment will have the same reference numeral applied thereto anddiscussion thereof will be correspondingly limited in regard to thesecond embodiment. Further, while overlay error illustrated in FIGS. 1-3is not illustrated in connection with the second embodiment, it shouldbe understood that the second embodiment is similarly tolerant ofoverlay errors, as well.

The second embodiment 400 of the invention illustrated in FIGS. 4-6 isreferred to, for convenience as a “sacrificial liner” process or a“liner first” process which will now be described. Beginning with astructure topologically similar to that of FIG. 1, a liner 410 ofalloying material such as those mentioned above is applied by anisotropic deposition process, preferably physical vapor deposition orsputtering. This deposition should provide a thickness of alloyingmaterial of a thickness of 50 to 500 Angstroms to provide, in view ofthe height of the via, a suitable volume of alloying material to formthe alloy annulus of desired dimensions (e.g. to extend under thethickness of the barrier to the border of the via).

However, it is preferred that the thickness of the alloying materialliner 410 be maintained as thin as possible since, in theory, a voidwill be formed as the alloying material is reacted. However, (withoutwishing to be held to any particular rationale for a phenomenon which istheoretical, has not been observed and of no discernible effect inregard to the successful practice of the invention) the development of avoid, if it occurs, may be a very minuscule event and the alloying toform a very thin and shallow annulus may become stable before allalloying material is consumed possibly due to the formation of a shallowvoid immediately above the alloy annulus and terminating the alloyingreaction. In any event, no deleterious effects attributable to a voidhas been observed and the dimensions of the alloy annulus arenon-critical to development of improved resistance to via breakage inaccordance with the invention. Therefore, the invention may besuccessfully practiced with any thickness of alloying material in theabove range and, in effect, the noted preference for a thinner layer ofalloying material is principally theoretical.

The deposition of liner 410 is followed by deposition of a barrier layer420 of one of the above-mentioned barrier materials, preferably tantalumnitride deposited by sputtering, to a thickness also between 50 and 500Angstroms. Again, thinner layers of barrier material (e.g. somewhat lessthan the diffusion length of the alloying material) are preferred toavoid consuming more of the via space than necessary and to assure thatthe alloy annulus which will be formed later will reach the copper inthe via. The barrier layer deposition is followed by an anisotropic,vertical argon sputter etch which removes barrier 420 and liner 410 atthe bottom of the trench and on other surfaces parallel to the surfaceof the V1/M2 layer, leaving liner 410 and barrier 420 only on the trenchsidewalls, as shown in FIG. 5.

Further, as shown in FIG. 5, this anisotropic etch process alsooptionally but preferably recesses (415) the copper of conductor 120 atthe trench bottom which increases the area of the copper to copperinterface and provides for current to largely bypass the alloy annulus.A tantalum second barrier layer 420′ (which may be required to protectthe low-k ILD, if used) and a seed layer 430 are then applied as in thefirst embodiment and copper 440 is applied, preferably by plating(although other processes may allow omission of the seed layer, as iswell-understood in the art) and planarized. The second embodiment of theinvention is completed by annealing to form an alloy annulus below thesidewalls 410 as shown in FIG. 6 where the alloying material contactsthe underlying copper, as limited by the barrier layer 420 (and 420′). Asectional view of the alloy annulus at section A-A is shown in FIG. 6A.The annealing can be performed at any time after barrier layer 420 is inplace and annealing prior to deposition of the via copper may bepreferable in some circumstances.

This process can, of course, provide many possible final structures andcombinations of materials for the resulting layered structure of thesidewall and barrier, particularly when it is considered that either orboth of the sidewall and the barrier structures may be multi-layerstructures. Some combinations of sidewall/barrier are Sn/Ta, Ta/CuSn/Taand Al/Ta.

In summary, the second embodiment provides increased structuralintegrity with reduced potential compromise of conductivity at thevia-line contact since the copper via extends into a recess in the M1conductor layer and alloy is formed at the periphery thereof wherestresses due to thermal cycling will be greatest. Perhaps moreimportantly, the copper of the M1 layer wiring is directly adjacent tothe copper of the via in the V1/M2 layer for further reduced resistancecompared with the first embodiment since no alloy is interposed betweenthe via and the connecting line.

It should be appreciated that the sacrificial liner technique can alsobe applied in a manner similar to the first embodiment by reversing theorder of the liner 410 and barrier 420 and depositing the alloyingmaterial at a high temperature to react with the underlying copper priorto deposition of the tantalum barrier layer 420′. Alternatively, analloy annulus can be formed using the barrier 420′ instead of barrier420 when the barrier and alloying material layer are reversed and thenannealing after formation of barrier 420′ or during deposition oftantalum at a high temperature.

Referring now to FIGS. 7-9, a third embodiment of the invention will bediscussed. The third embodiment of the invention may be generallyconceptualized as an inversion of the first embodiment, described above.The third embodiment also employs the principle of confining thealloying material using a barrier layer. However, the diffusion duringalloying is in the upward direction into the copper of the via in theV1/M2 layer rather than downward into the M1 layer connection. Anadditional difference is that the alloying element is disposed as a capcovering the top surfaces for all the interconnects on the lower level,but blocked from reacting with the interconnect material by a barrierlayer. Thus the alloying material will only react in areas contactedfrom above by vias.

This difference may be useful in some processing circumstances andprovides advantages of increased resistance to damage of the via/wiringconnection as well as reduced resistance and increased stability oflocation and composition of alloy compared with prior processes asproduced by the first and second embodiments described above. However,small quantities of unreacted alloying material may remain, the alloyedregion may be slightly thicker than in the first embodiment and theprocessing is more complex than either the first or second embodimentsof the invention. Therefore, the third embodiment is not preferred forgeneral application but may provide the meritorious effects of theinvention in structures to which the first and second embodiments cannotbe applied.

FIG. 7 shows an M1 layer topologically identical to that of the first orsecond embodiments including, in this case, a Damascene conductor 130supported by an insulator 110. As shown in FIG. 8, the copper wiring ofthe M1 layer is recessed slightly, preferably in the range of 10 to 50nm or slightly more than the barrier layer required to control diffusionof the alloying material. Then, barrier layer 710 is deposited and alayer of alloying material 720 deposited thereover. Layers 710 and 720are then planarized by polishing back to the original M1 layer surfaceor slightly beyond to achieve the desired thickness of alloying materialfilm. The V1/M2 layer is then formed, as shown in FIG. 9, by depositingand patterning the ILD 160 and a bottomless liner 740 (where both theTaN and Ta (or other material) barrier layers are sputtered open at thevia bottoms) and copper 330 deposited, preferably by plating afterdepositing a seed layer, as discussed above. The third embodiment of theinvention is then completed by annealing to diffuse and alloy materialfrom layer 720 with copper 330. The annealing should be carried outsufficiently to consume the entirety of layer 720 with copper 330diffusing into the region 750 above barrier layer 710 surrounding thevia while the alloying material diffuses upwardly for only a shortdistance. Thus, as in the first and second embodiments, the alloying isstabilized by consumption of the alloying material and confined to anextremely thin layer by a thin conductive barrier layer to achieveincreased strength at the via/wiring interface without significantcompromise of the low resistance provided by the copper wiring.

In view of the foregoing, the invention provides improved reliability ofintegrated circuit interlayer connections while preserving lowelectrical resistance by forming copper alloy of desired mechanicalproperties but confining the alloy to an extremely thin region at theinterlayer via/wiring interfacial region and not elsewhere. Theinvention is not limited to copper vias and interconnects but is equallyapplicable to copper alloys and other metals and their alloys as well asat interfaces between different metals and/or metal alloys and instructures other than connections between lines and vias. The thicknessof an alloy region is reduced or substantially avoided in the conductionpath by confinement of diffusion of the alloying material to only thevia or the wiring copper or to an annulus surrounding the conductionpath.

While the invention has been described in terms of a single preferredembodiment, those skilled in the art will recognize that the inventioncan be practiced with modification within the spirit and scope of theappended claims.

1. An integrated circuit including a first layer having metal or metalalloy at a surface thereof, a second layer adjacent to said surfacehaving a metal or metal alloy via therein, an interlayer connectionbetween metal or metal alloy of said first layer and said metal or metalalloy via comprising an alloy region restricted to an interfacial regionof said metal or metal alloy of said first layer and said metal or metalalloy via by a barrier layer.
 2. The integrated circuit as recited inclaim 1, wherein said metal or metal alloy of said first layer is afirst metal and said metal or metal alloy of said second layer is asecond metal.
 3. The integrated circuit as recited in claim 1, whereinsaid metal or metal alloy comprises copper.
 4. The integrated circuit asrecited in claim 1, wherein said barrier includes a layer of tantalum,tungsten or titanium or alloys or nitrides thereof.
 5. The integratedcircuit as recited in claim 1, wherein said barrier comprises a layer oftantalum nitride and a layer of tantalum.
 6. The integrated circuit asrecited in claim 1, wherein said metal alloy of said interlayerconnection at said interface includes tin, indium, nickel, gold, silver,aluminum, beryllium, tellurium, magnesium, zinc or zirconium.
 7. Theintegrated circuit as recited in claim 1, wherein said barrier is abovesaid interlayer connection and said metal alloy of said interlayerconnection is confined to a region below said barrier.
 8. The integratedcircuit as recited in claim 1, wherein said metal alloy of saidinterlayer connection is formed as an annulus in said metal or metalalloy at a surface of said first layer.
 9. The integrated circuit asrecited in claim 8, wherein said via extends into said metal or metalalloy of said first layer surrounded by said annulus.
 10. The integratedcircuit as recited in claim 1, wherein said barrier is below saidinterlayer connection and said metal alloy of said interlayer connectionis confined to a region above said barrier.
 11. A method of forming aconnection between metal or metal alloy at a surface of a first layerand a metal or metal alloy via of a second layer, said method comprisingsteps of depositing an alloying material, and forming an alloy confinedto an interfacial region of said metal or metal alloy at a contactsurface between said first layer and said metal or metal alloy of saidsecond layer by a barrier.
 12. The method as recited in claim 11,wherein said metal or metal alloy of said first layer is a first metaland said metal or metal alloy of said second layer is a second metal.13. The method as recited in claim 11, wherein said metal or metal alloycomprises copper.
 14. The method as recited in claim 11, wherein saidbarrier includes a layer of tantalum, tungsten or titanium or alloys ornitrides thereof.
 15. The method as recited in claim 11, wherein saidbarrier comprises a layer of tantalum nitride and a layer of tantalum.16. The method as recited in claim 11, wherein said metal alloy of saidinterlayer connection at said interface includes tin, indium, nickel,gold, silver, aluminum, beryllium, tellurium, magnesium, zinc orzirconium.
 17. The method as recited in claim 11, wherein said barrieris formed above said connection and said metal alloy of said connectionis confined to a region below said barrier.
 18. The method as recited inclaim 11, wherein said metal alloy of said connection is formed as anannulus in said metal or metal alloy of said first layer.
 19. The methodas recited in claim 18, wherein said metal or metal alloy of said secondlayer extends into said metal or metal alloy of said first layersurrounded by said annulus.
 20. The method as recited in claim 11,wherein said barrier is below said connection and said metal alloy ofsaid connection is confined to a region above said barrier.